
The most exciting parameters of this generation of A11X chips are undoubtedly built on TSMC's 7nm process and are integrated fan-out wafer level packaging (InFO WLP). Architecture design, broke the news that the A11X uses 8 core design, three large nuclear Monsoon, five small nuclear Mistral, at the same time built-in M11 coprocessor and NPU (neural computing unit).
The current A11 Bionic chip features two high-power Monsoon cores and four low-power Mistral cores, all independently addressable.
Share Article:
Facebook, Twitter, LinkedIn, Google Plus, Email, Reddit, Digg, Delicious, StumbleUpon
Follow iClarified:
Facebook, Twitter, LinkedIn, Google Plus, Newsletter, App Store, YouTube

Post a Comment